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Samsung Electronics is planning for 1.4-nm manufacturing by 2027, in line with a roadmap it publicized for its chip foundry enterprise.
The corporate is elevating the ante with high rival Taiwan Semiconductor Manufacturing Co. (TSMC) as demand for superior semiconductors has soared.
Samsung stated high-performance computing (HPC), AI, 5G/6G, and automotive functions are driving demand.
“The expertise growth objective right down to 1.4 nm and foundry platforms specialised for every software, along with steady provide by way of constant funding, are all a part of Samsung’s methods to safe clients’ belief and help their success,” Si-young Choi, foundry enterprise president at Samsung Electronics, stated in a ready assertion. “Realizing each buyer’s innovation with our companions has been on the core of our foundry service.”
The corporate this yr was first to announce 3-nm manufacturing.
Samsung will improve its gate-all-around (GAA) expertise with plans to introduce a 2-nm course of in 2025.
The corporate didn’t disclose figures on funding in capability enlargement.
Foundries like TSMC and Samsung have outpaced development within the semiconductor trade.
The 31% enhance in chip foundry income to $100.2 billion led development within the general semiconductor trade final yr, in line with market analysis agency Gartner. Within the superior 7-nm and 5-nm nodes, the place TSMC had greater than 90% of the market, the corporate’s key clients have been Apple, AMD, and MediaTek, in line with Gartner.
Samsung’s most important clients—Qualcomm, Nvidia, and Tesla—counted on the corporate for manufacturing of much less superior 8-nm and 14-nm chips, in line with the market analysis agency.
Along with TSMC, Samsung will face rising competitors from Intel Foundry Providers (IFS), which began enterprise a couple of yr in the past. IFS plans to supply its personal GAA-based course of at its 18-A node that’s equal to 2 nm by 2024.
TSMC will begin manufacturing of 2-nm chips in 2025.
3D packaging
Samsung is accelerating the event of two.5D/3D heterogeneous integration packaging for foundry clients.
The corporate stated its X-Dice 3D packaging with micro-bump interconnect will likely be prepared for manufacturing in 2024, and a bump-less model of X-Dice will likely be accessible in 2026.
Samsung is concentrating on high-performance and low-power segments in HPC, automotive, 5G, and the web of issues. The corporate will improve its GAA-based 3-nm course of help for HPC and cellular, whereas diversifying a 4-nm course of custom-made for HPC and automotive functions.
For automotive clients, Samsung offers an embedded nonvolatile reminiscence (eNVM) course of based mostly on 28-nm expertise. The corporate plans to increase course of nodes by launching 14-nm eNVM options in 2024 and including 8-nm eNVM at an undisclosed date.
Samsung is in manufacturing of 8-nm RF, with 5-nm RF beneath growth.
The corporate stated it plans to triple its manufacturing capability for superior nodes by 2027.
Samsung’s foundry services are situated in South Korea and Texas.
