To help the launch of next-generation server platforms from AMD and Intel, Samsung plans to introduce a lineup of all-new DDR5 server reminiscence modules topped by the trade’s first 512GB RDIMM/LRDIMM and primarily based on 16Gb and 24Gb DDR5 gadgets. The following step in Samsung’s DDR5 innovation — a 32Gb IC — will are available early 2023 and allow the corporate to construct a 1TB reminiscence module in late 2023 or early 2024. In the meantime, in two years, Samsung intends to launch ICs with a 7200 MT/s knowledge switch price.
1TB DDR5 RDIMMs in 2024, 2TB Modules on Horizon
JEDEC’s DDR5 specification presents huge advantages for server platforms. Along with enhanced efficiency scalability, they introduce new methods to extend per-chip and per-module capacities together with enhanced reliability and yield-improving strategies. Moreover, the spec permits to construct as much as 64Gb monolithic DDR5 reminiscence gadgets and to stack as much as 16 DDR5 ICs right into a chip (as much as 16 ICs whose capability is decrease than 64Gb). Due to this fact, the emergence of 32Gb DDR5 ICs mustn’t come as a shock.
“32Gb DDR5 [IC] is now underneath improvement on a brand new [under-14nm] course of node and is scheduled to be launched early subsequent 12 months,” stated Aaron Choi, employees engineer at Samsung’s DRAM planning division, at AMD’s and Samsung webinar (see Samsung’s presentation in a gallery beneath). “32Gb-based UDIMMs might be accessible from the top of subsequent 12 months or early in 2024.”
Samsung intends to formally introduce 32Gb DDR5 gadgets someday early subsequent 12 months to have fun the finalization of its improvement. These chips will ramp in direction of the top of 2023, when Samsung may formally unveil the primary merchandise on their base — 32GB unbuffered DIMMs for shopper PCs. Later, the corporate will reveal its 1TB DDR5 reminiscence modules that can use 32 8-Hello 32GB stacks and might be aimed toward server platforms arriving within the 2024 – 2025 timeframe.
For now, DRAM makers like Samsung use 8-Hello stacks with as much as eight reminiscence gadgets, however a number of years later, they may transfer to extra huge stacks. For instance, squeezing 16 32Gb DRAM ICs or eight 64Gb DRAM ICs right into a stack will allow Samsung to construct 2TB server-grade DDR5 modules and permit machines with tens of terabytes of reminiscence per socket (e.g., a 12-channel reminiscence subsystem supporting two DIMMs per channel may rise up to 48TB of reminiscence).
DDR5-7200 in 2025
As soon as yields of Samsung’s 32Gb DDR5 reminiscence gadgets get to ranges similar to these of 16Gb ICs, these chips will enable the constructing of very decently priced single-sided 32GB DIMMs, enabling desktop lovers to equip their methods with 128GB of reminiscence with out breaking the financial institution.
However whereas capability issues, excessive speeds are additionally vital for lovers, so Samsung is working onerous to enhance the efficiency of DDR5 gadgets. The corporate is about to introduce ICs formally rated at 5200 MT/s – 5600 MT/s and aimed on the upcoming shopper PC platforms. We anticipate these chips for use by module homes like Corsair and G.Ability to construct modules rated for 6800 MT/s – 7000 MT/s and past, however these would require elevated voltages.
Samsung envisions DDR5 chips able to a 7200 MT/s knowledge switch price at JEDEC-standard 1.1 Volts solely in 2025. DDR5-7200 is a velocity bin that Samsung has been speaking about for a while, however with out disclosing when it expects to provide acceptable gadgets. On the webinar, the corporate lastly demonstrated a slide that attributes ‘DDR5-7200+’ to 2025. So anticipate reminiscence module consultants to hit speeds of 10,000+ MT/s (and better) with such ICs.
Samsung’s DDR5 Server Lineup Prepared for Subsequent-Technology Server Platforms.
Samsung and its trade friends have been speaking about their server-grade DDR5 reminiscence modules for fairly a while now. Nonetheless, since there have been no server platforms to help the brand new kind of reminiscence, these bulletins have been extra about promised benefits of DDR5 reminiscence (or bragging rights for DRAM corporations, if you want) than sensible use instances. However now that AMD’s and Intel’s next-generation server platforms are approaching, these modules will lastly be used.
Samsung formally launched its 512GB DDR5 registered DIMM (RDIMM) reminiscence module in mid-2021 and had began sampling the product even earlier than that. That module makes use of 32 16GB stacks primarily based on eight 16Gb DRAM gadgets and represents a pinnacle for immediately’s DRAM trade. These modules might be accessible in time for next-generation AMD EPYC ‘Genoa’ and Intel Xeon Scalable ‘Sapphire Rapids’ server platforms late in 2022 or early 2023.
However not everybody wants 512GB reminiscence modules, even for servers, so Samsung launched 24Gb DDR5 ICs final July to help modules with capacities like 24GB, 48GB, 96GB, and probably larger. For now, Samsung doesn’t disclose plans to make 384GB and 768GB primarily based on 24Gb gadgets. Nonetheless, its lineup of DDR5 modules for this 12 months consists of all the pieces from 16GB to 512GB, which is nice sufficient to handle next-generation AMD EPYC ‘Genoa’ and Intel Xeon Scalable ‘Sapphire Rapids’ platforms within the foreseeable future.
“Final 12 months, Samsung launched 14nm DDR5 DRAMs, and they’re now ramping up,” stated Choi. “14nm permits to make one other larger [DRAM] die, which is 24Gb, and it’s nearly able to launch together with AMD’s server milestones. […] This 12 months Samsung will present a number of lineups [based on] 24Gb dies.”
Whereas a 24GB, 48GB, or 96GB module capability might not sound as spectacular as a 512GB capability, these reminiscence sticks could also be useful for next-generation servers primarily based on AMD’s EPYC ‘Genoa’ and ‘Bergamo’ processors. Since AMD’s next-generation server platform helps 12 reminiscence channels, the modules will allow machines with 288MB, 576GB, or 1152GB of DDR5 reminiscence per socket, which could be very spectacular. In the meantime, since 24GB, 48GB, and 96GB modules don’t want such refined chip-level packaging as Samsung’s 512GB RDIMM (which makes use of 8-Hello 3DS stacks), they could present a powerful mixture of capability, efficiency, and value.
Abstract
Samsung is prepared with a lineup of server-grade DDR5 reminiscence modules primarily based on its monolithic 16Gb and 24Gb DRAM ICs. These reminiscence sticks will characteristic capacities between 16GB and 512GB and can help velocity bins supported by AMD’s Genoa/Bergamo in addition to Intel’s Sapphire Rapids platforms.
Samsung’s subsequent step might be introducing a 32Gb monolithic DDR5 die in early 2023 and bringing it to market by late 2023 or early 2024. These chips will allow the corporate to construct 1TB DDR5 reminiscence modules for future server platforms and cheap 32GB UDIMMs for shopper PCs.
As for speeds, Samsung is wanting ahead to launching DDR5-7200+ at 1.1V ICs in circa 2025, which is able to enable producers of reminiscence modules for overclockers to construct reminiscence sticks rated for operation at 10,000 MT/s and past.
