Nihon Superior Co. Ltd., a provider of superior becoming a member of supplies, is happy to introduce its LF-C2 Lead-Free Solder Paste. Designed for automotive functions, LF-C2 is the high-strength alloy of alternative when cracking minimization is a key choice criterion.
The demand of the automotive business for solder alloys that ship lengthy life in situations of maximum thermal biking has resulted within the improvement of alloys which might be very exhausting. Whereas these exhausting alloys are proof against the plastic deformation that drives failure in thermal biking, the trade-off is that their hardness implies that they generally tend to crack when uncovered to the opposite stresses to which automotive electronics is subjected in service. Nihon Superior’s LF-C2 strikes a stability between these two necessities, delivering lengthy life in thermal biking however with compliance, which implies that it’s proof against cracking below different loading situations.
This balanced efficiency is achieved through the use of calibrated ranges of the 2 key strengthening instruments out there in solder alloy formulation, secure dispersed particles mixed with strong resolution strengthening of the tin matrix.
With a liquidus temperature of 213°C LF-C2 may be reflowed at a decrease temperature than SAC305 and has the next shear energy than SAC305.
The fully halogen-free P608 flux medium delivers wetting comparable with that achieved with halogen-containing flux media. LF-C2 delivers glorious efficiency over a variety of element varieties and course of parameters.
Nihon Superior continues to supply options to the challenges going through the electronics business, reminiscent of enhancements in reliability, thermally secure connections, and lead-free die connect.
