Indium Company has introduced a brand new jetting solder paste in its line of PicoShot merchandise. PicoShot WS-5M is designed for purchasers needing an SnPb solder paste for his or her Mycronic MY-series jet printers.
PicoShot WS-5M is a water-soluble, halogen-free paste developed because of a detailed, collaborative relationship with Mycronic for his or her MY 600/700 jetting methods. This product has been beta-tested at buyer websites, displaying confirmed efficiency on buyer traces.
PicoShot WS-5M has been extensively examined to offer distinctive jetting efficiency. It delivers:
- Smallest dot quantity amongst pastes in its class: 6.5nl/dot, 350µm diameter
- Precision deposit (x,y concentrating on)
- Lengthy utilization (syringe life) >8 hours
- Minimal statellites
PicoShot WS-5M is a water-soluble, halogen-free solder paste authorised after joint Indium/Mycronic technical improvement with Mycronic’s MY 600/700 jetting methods. PicoShot can be utilized in purposes, similar to jetting into cavities and uneven/warped substrates, high-mix/low-volume stencil substitute, CSP/microBGA solder connect, navy and aerospace jetting purposes, system-in-package (SiP), digital camera module meeting the place an over-moulding step is required, and shield-attach and secondary processing.
Using a Kind 5 solder powder and an SnPb alloy, this materials is inherently chemically appropriate with Indium Company’s Indium6.6HF-HD Solder Paste. PicoShot® WS-5M’s distinctive oxidation barrier promotes full powder coalescence throughout reflow to eradicate graping and comparable reflow points.
PicoShot WS-5M jetting solder paste is the second materials to come back out of Indium Company’s new partnership with Mycronic, a worldwide chief in allotting and jet printing tools.
