Samsung has shared a brand new foundry companies roadmap, plotting a course from its present 3nm expertise, via 2nm, to 1.4nm semiconductor mass manufacturing. In response to the South Korean tech big, these vital steps will happen over the subsequent 5 years.
Wanting in direction of the subsequent step for its Foundry Enterprise, in 2025, Samsung says that 2nm will characteristic an enhanced model of the GAA expertise which debuted this summer time with its 3nm output. Developments will proceed with the arrival of its 1.4nm course of, in 2027. Furthermore, different synergistic technological progress is being labored on for Samsung’s upcoming ranges of semiconductor choices, specifically; the event of two.5D/3D heterogeneous integration packaging expertise, 3D packaging X-Dice with micro-bump interconnection, and extra.
Properly cautious of downturns going through different components of its enterprise, Samsung has mentioned an operational plan to arrange new manufacturing capability ‘shell first’. It says that will probably be greater than tripling its superior manufacturing node capability by 2027, but it’s going to proceed to pre-prepare further capability within the type of unpopulated clear rooms—prepared for demand surges whereas minimizing speculative funding. It’ll start its ‘shell first’ preparations in areas of its new $18 billion semiconductor plant in Taylor, Texas.
