Intel CEO Pat Gelsinger has visited Seoul to talk with a number of high Samsung executives, reviews the Korea Herald. The discussions, confirmed by Samsung, have sparked discuss of doable new collaborative plans between Intel and the Korean electronics big.
After attending the 2022 World Financial Discussion board in Davos, Switzerland, Gelsinger flew to South Korea and met up with Samsung executives. Across the desk had been Samsung Electronics Vice Chairman Lee Jae-yong, co-CEO and chip enterprise boss Kyung Kye-hyun, head of Samsung Cell Roh Tae-moon, in addition to different high-ranking Samsung executives.
The Korea Herald does not have any official assertion or government quotes relating to the assembly. Nonetheless, it says the meet up raises expectations of collaboration between these two chip making goliaths, because the race for subsequent technology course of know-how intensifies. As a Korean publication it is not shocking to see the Herald counsel that Samsung is forward of Intel by a number of key semiconductor manufacturing metrics. It even mentions Intel’s well-known stumble over 10nm and issue in breaking this ultimate double digit nanometer barrier. There’s some reality about that assertion although, as we should not neglect the present (Alder Lake) ‘Intel 7’ course of is a rebrand of Intel 10nm Enhanced SuperFin.
The supply mentions earlier Intel / Samsung collaboration as additional ‘proof’ of collaborative talks being held. Whereas we will not present any definitive cause or affirm the Korea Herald’s assertions, Gelsinger was undoubtedly there for enterprise, and to not speak about new TVs or smartphones. Concepts about collaborative works involving Intel processors plus Samsung reminiscence chips and reminiscence interfaces had been floated within the supply article, however could also be nothing greater than reporter mind storming.
Intel already has some agreements with TSMC, the world’s largest contract chip producer and rival to each Intel and Samsung on this regard. As just lately as April, Gelsinger was in Taiwan on a quest to safe extra of TSMC’s sub-7nm manufacturing capability. No specifics had been revealed on the time of the go to, with regard to the components Intel needs extra of.
Some gentle is solid upon Intel’s dealings previous, current and future by its newest management roadmap. Intel will probably be making use of ‘Exterior N3’ for one of many tiles in its Meteor Lake and Arrow Lake chips. N3 is TSMC’s nomenclature for its 3nm course of know-how. On the identical time, Intel goes to make a major improve of its personal, to Intel 4 (beforehand known as Intel 7nm, enhanced with EUV lithography).
On the subject of Meteor Lake and Arrow Lake, we just lately reported that these chips will probably be among the many first to make use of Intel Foveros 3D know-how. We must always hear rather more about these processors from Intel in August when there’s a presentation about them scheduled at Scorching Chips 34. Meteor Lake is anticipated to reach in 2023 and is the codename for the 14th gen Intel Core processors.
Intel Lunar Lake and past we see that Intel’s roadmap does not give any trace concerning the exterior foundry know-how which can accompany its personal 18A CPU tiles. This could possibly be the place Samsung steps in, prepared for 2024. Alternatively it’s doable it has received some orders previous to Lunar Lake.
